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1 монтаж методом перевёрнутого кристалла
1) Engineering: face bonding (выводами к подложке), face-down bonding (выводами к подложке), flip-chip bonding (выводами к подложке)2) Electronics: back bonding, face-down mounting, flip chipping, flip-chip assembly, flip-chip mount, flip-chip mounting, flip-over, inboard bonding3) Microchip technology: flipchip4) Microelectronics: flip-chip, flip-chip attachment, inboard boardingУниверсальный русско-английский словарь > монтаж методом перевёрнутого кристалла
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2 модульная конструкция
1. modular assemblyсъемная блочная конструкция; съемный блок — plug-in assembly
блочная конструкция; модульная конструкция — modular design
2. modular design3. modular construction4. modular constructionsРусско-английский большой базовый словарь > модульная конструкция
См. также в других словарях:
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